Heat sink heat dissipation pins and heat dissipation terminals
Heat is easily transmitted and dissipated! Long terminals with high heat dissipation capability can also be produced.
This product is processed by forging metal wire into the desired shape, allowing for lower mold costs compared to extrusion molded products. The length of the heat dissipation pins and the layout on the heat dissipation plate are flexible. We can also manufacture long terminals with high heat dissipation properties. Depending on the needs of customers considering heat dissipation measures for circuit boards and IC components, we provide consistent support from material selection to prototyping and mass production. 【Features】 ■ Processed into the desired shape ■ Mold costs can be kept low ■ Flexible layout on the heat dissipation plate ■ Consistent support from material selection to prototyping and mass production *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所
- Price：Other
